Call: Tangible, Embedded and Embodied Interaction (TEI) 2019

Call for Participation

ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) 2019
17-20 March 2019
Tempe, Arizona
http://www.tei-conf.org/2019

Paper submission deadline: August 8, 2018

TEI 2019 is the 13th annual conference dedicated to presenting the latest results in tangible, embedded, and embodied interaction. It will be held 17th to 20th March, 2019, and is hosted by Arizona State University in Tempe, Arizona, USA. The conference will be sponsored by ACM SIGCHI and Arizona State University.

The TEI conference has gained substantial visibility and activity over the past decade. It brings together researchers, practitioners, businesses, artists, designers and students from various disciplines, including engineering, interaction design, product design, computer science, and the arts. Application areas are diverse, including: human-augmentation, flexible and shape changing displays, haptic interaction, interactive surfaces, public art and performance, interactive robotics, games, learning, planning, automotive, fashion, furniture, architectural design, music and sound creation, as well as productivity and creativity tools in domains ranging from scientific exploration to non-linear narrative.

The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, demonstrations, posters, art installations and performances, and participating in hands-on studio/workshops. We invite submissions from all of these perspectives: theoretical, conceptual, technical, applied, or artistic.

THEME: HYBRID MATERIALS

Over the past few years, TEI research has increasingly embraced hybridity, whether through material explorations of composites such as bioelectronic, on-body, or active materials, or theoretical inquiries into socio-technical systems as hybrid assemblies. Not confined to a single approach, we have seen advancements in new materials—such as conductive and thermochromic inks, OLEDs, biosensors, or bioelectronics—which have helped to embed computing in the physical world. Simultaneously, comparisons between tangible computing and crafting traditions—such as crocheting or weaving—have served to destabilize assumptions about ‘low’ and ‘high’ technologies, the cultures that surround them, and even which communities have been able to participate in the discussion. These hybrid, materially-oriented approaches are radically changing our understanding of what tangible interaction looks and feels like. The theme of Hybrid Materials will continue to catalyze this exciting trend of tangible interaction research at the intersection of social, technical, biological, and artistic systems.

TRACKS AND DATES

We invite submissions to the following tracks (with corresponding submission deadlines at 12pm PST):

Papers: August 8, 2018

Studio: August 29, 2018

Arts Track: November 7, 2018

Graduate Student Consortium: November 9, 2018

Work in Progress: November 14, 2018

Student Design Challenge: November 26, 2018

Student Volunteers: January 1st, 2019 (applications deadline)

Studios and Graduate Student Consortium meeting at TEI 2019: March 17, 2019 (Sunday)

More information about each track is available here:
https://tei.acm.org/2019/index.html

MORE INFORMATION

https://tei.acm.org/2019/people.html
http://www.tei-conf.org/2019

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