Call for Participation
ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) 2019
17-20 March 2019
Tempe, Arizona
http://www.tei-conf.org/2019
Paper submission deadline: August 8, 2018
TEI 2019 is the 13th annual conference dedicated to presenting the latest results in tangible, embedded, and embodied interaction. It will be held 17th to 20th March, 2019, and is hosted by Arizona State University in Tempe, Arizona, USA. The conference will be sponsored by ACM SIGCHI and Arizona State University.
The TEI conference has gained substantial visibility and activity over the past decade. It brings together researchers, practitioners, businesses, artists, designers and students from various disciplines, including engineering, interaction design, product design, computer science, and the arts. Application areas are diverse, including: human-augmentation, flexible and shape changing displays, haptic interaction, interactive surfaces, public art and performance, interactive robotics, games, learning, planning, automotive, fashion, furniture, architectural design, music and sound creation, as well as productivity and creativity tools in domains ranging from scientific exploration to non-linear narrative.… read more. “Call: Tangible, Embedded and Embodied Interaction (TEI) 2019”